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 Professor
Electrical Engineering
Educational Background:
B.S. Electrical Eng., Harbin Naval Engineering Institute, 1978
M.S. Physics, Hangzhou University, 1981
Ph.D. Physics, SUNY Buffalo, 1987
Email:
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Phone: (607) 871-2130
Location: Engineering Lab, Room 218
Website: http://cact.alfred.edu
Research Overview
Main focus is related to thin film coatings. Coating facility includes:
- ion-assisted electron-beam deposition;
- pulsed DC, DC and RF sputtering;
- RF plasma aerosol mist deposition.
Thin film materials include oxides and nitrides. Substrate materials are single crystals, ceramics and glass. Substrate shapes can be flat, cylindrical and wire-like.
Current and Recent Projects
Nitride and oxide thin films for anti-corrosion applications
- Ion-assisted electron beam deposition of oxide films.
- Pulsed DC sputtering of nitride films.
- RF plasma aerosol mist deposition of oxides.
Select Publications and Patents
U.S. Patents (45 total)
“Magnetic resonance imaging coated assembly,” U.S. Patent No. 7,473,843, January 6, 2009. (with H. Greenwald, et al.)
“Magnetically shielded assembly,” U.S. Patent No. 7,162,302, January 9, 2007. (with H. Greenwald, et al.)
“Protective assembly,” U.S. Patent No. 6,971,391, December 6, 2005. (with H. Greenwald, et al.)
“Assembly for utilizing residual battery energy,” U.S. Patent No. 6,914,412, July 5, 2005. (with R. Fransman)
“Nanomagnetic shielding assembly,” U.S. Patent No. 6,906,256, June 14, 2005.
“Magnetically shielded conductor,” U.S. Patent No. 6,876,886, April 5, 2005.
Publications (84 total)
“Combinatorial synthesis and characterization of magnetic FexAl1-xNyO1-y thin films,” Thin Solid Films, Vol. 516, Issue 18, 31 July 2008, Pages 6063-6070. (with Y. Guan, et al.)
“Aluminum oxide and silicon nitride thin films as anti-corrosion layers,” Ceramic Engineering & Science Proceedings, Vol. 31, No. 3, 2010, pp. 123-134. (with C. Qu, et al.)
“Comparison of oxide and nitride thin films - electrochemical impedance measurements and materials properties,” Ceramic Transactions Vol. 214, 2010, pp. 131-146. (with Y. Liu, et al.)
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